CE201-5-FY-KS:
Team Project Challenge

The details
2022/23
Computer Science and Electronic Engineering (School of)
Kaplan Singapore
Full Year
Undergraduate: Level 5
Future
Thursday 06 October 2022
Friday 30 June 2023
15
-

 

Requisites for this module
(none)
(none)
(none)
(none)

 

(none)

Key module for

BSC G610 Computer Games,
BSC G612 Computer Games (Including Year Abroad),
BSC G620 Computer Games (Including Foundation Year),
BSC I610 Computer Games (Including Placement Year),
BENGG420 Computer Networks,
BENGG421 Computer Networks (Including Year Abroad),
BENGG520 Computer Networks (Including Foundation Year),
BENGI120 Computer Networks (Including Placement Year),
BSC G400 Computer Science,
BSC G401 Computer Science (Including Year Abroad),
BSC G403 Computer Science (Including Foundation Year),
BSC I101 Computer Science (Including Placement Year),
MSCIG402 Computer Science,
MSCII100 Computer Science (Integrated Masters, Including Placement Year),
BENGH650 Computer Systems Engineering,
BENGH651 Computer Systems Engineering (Including Year Abroad),
BENGH750 Computer Systems Engineering (Including Foundation Year),
BENGHP50 Computer Systems Engineering (Including Placement Year),
BENGGH46 Computers with Electronics (Including Foundation Year),
BENGGH4P Computers with Electronics,
BENGGH4Q Computers with Electronics (Including Year Abroad),
BENGI1H6 Computers with Electronics (Including Placement Year),
BENGH610 Electronic Engineering,
BENGH611 Electronic Engineering (Including Year Abroad),
BENGH61P Electronic Engineering (Including Foundation Year),
BENGHP10 Electronic Engineering (Including Placement Year),
MENGH613 Electronic Engineering,
MENGH614 Electronic Engineering (Integrated Masters, Including Placement Year),
BENGH641 Communications Engineering,
BENGHP41 Communications Engineering (Including Foundation Year),
BENGHPK1 Communications Engineering (Including Placement Year),
BENGHQ41 Communications Engineering (Including Year Abroad),
BSC I1G3 Data Science and Analytics,
BSC I1GB Data Science and Analytics (Including Placement Year),
BSC I1GC Data Science and Analytics (Including Year Abroad),
BSC I1GF Data Science and Analytics (Including Foundation Year),
BENGH615 Robotic Engineering,
BENGH616 Robotic Engineering (Including Year Abroad),
BENGH617 Robotic Engineering (Including Placement Year),
BENGH618 Robotic Engineering (Including Foundation Year),
BSC G111 Computing,
BSC G112 Computing (Including Year Abroad),
BSC G113 Computing (Including Placement Year),
BSC GH01 Computing and Electronics,
BSC GH02 Computing and Electronics (Including Year Abroad),
BSC GH03 Computing and Electronics (Including Placement Year),
BSC GH3P Computing and Electronics (Including Foundation Year),
BSC H631 Electronics,
BSC H632 Electronics (Including Year Abroad),
BSC H633 Electronics (Including Placement Year),
BENGH730 Mechatronic Systems,
BENGH731 Mechatronic Systems (Including Year Abroad),
BENGH732 Mechatronic Systems (Including Placement Year),
BENGH733 Mechatronic Systems (Including Foundation Year),
BENGH169 Neural Engineering with Psychology,
BENGH170 Neural Engineering with Psychology (including Placement Year),
BENGH171 Neural Engineering with Psychology (including Year Abroad),
BENGH172 Neural Engineering with Psychology (Including Foundation Year),
BSC H737 Mechatronics,
BSC H738 Mechatronics (including Placement Year),
BSC H739 Mechatronics (including Year Abroad),
BSC H167 Neural Technology with Psychology,
BSC H168 Neural Technology with Psychology (including Year Abroad),
BSC H176 Neural Technology with Psychology (including Placement Year),
BSC H717 Robotics,
BSC H718 Robotics (including Placement Year),
BSC H719 Robotics (including Year Abroad),
BSC I400 Artificial Intelligence,
BSC I401 Artificial Intelligence (Including Foundation Year),
BSC I402 Artificial Intelligence (including Placement Year),
BSC I403 Artificial Intelligence (including Year Abroad)

Module description

No information available.

Module aims

No information available.

Module learning outcomes

No information available.

Module information

No additional information available.

Learning and teaching methods

No information available.

Bibliography

(none)

Assessment items, weightings and deadlines

Coursework / exam Description Deadline Coursework weighting
Coursework   Team Presentation    18% 
Coursework   Group MVP Individual Contribution     26% 
Coursework   Group Final Product Individual Contribution    40% 
Coursework   Individual Contribution Reflective Statement    16% 
Exam  Main exam: In-Person, Open Book (Restricted), 120 minutes during Summer (Main Period) 
Exam  Reassessment Main exam: In-Person, Open Book (Restricted), 120 minutes during September (Reassessment Period) 

Exam format definitions

  • Remote, open book: Your exam will take place remotely via an online learning platform. You may refer to any physical or electronic materials during the exam.
  • In-person, open book: Your exam will take place on campus under invigilation. You may refer to any physical materials such as paper study notes or a textbook during the exam. Electronic devices may not be used in the exam.
  • In-person, open book (restricted): The exam will take place on campus under invigilation. You may refer only to specific physical materials such as a named textbook during the exam. Permitted materials will be specified by your department. Electronic devices may not be used in the exam.
  • In-person, closed book: The exam will take place on campus under invigilation. You may not refer to any physical materials or electronic devices during the exam. There may be times when a paper dictionary, for example, may be permitted in an otherwise closed book exam. Any exceptions will be specified by your department.

Your department will provide further guidance before your exams.

Overall assessment

Coursework Exam
50% 50%

Reassessment

Coursework Exam
50% 50%
Module supervisor and teaching staff

 

Availability
No
No
No

External examiner

No external examiner information available for this module.
Resources
Available via Moodle
No lecture recording information available for this module.

 

Further information

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